hi-sincerity microelectronics corp. spec. no. : he200802 issued date : 2008.08.19 revised date :2009.11.06 page no. : 1/4 hsbr10100ct series ~hsbr10150ct series hsmc product specification hsbr10100ct series to hsbr10150ct series to-220fp to-220ab schottky barrier rectifiers (reverse voltage 100v to150v, forward current 10a) features ? low forward voltage drop ? high current capability ? high reliability ? high surge current capability ? high esd capability; mechanical data ? cases: to-220 molded plastic body ? epoxy: ul 94v-0 rate flame retardant ? lead: axial leads, solderable per mil-std-750, method 2026 guaranteed ? high temperature soldering guaranteed: 250 c/10seconds/.375?(9.5mm) lead lengths at 5lbs.(2.3kg) tension ? weight: 2.05gram maximum ratings & electrical characteristics ratings at 25 c ambient temperature unles s otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load. derate current by 20%. ratings symbol hsbr 10100cte hsbr 10100ctf hsbr 10150cte hsbr 10150ctf unit repetitive peak reverse voltage v rrm 100 150 v surge peak reverse voltage v rsm 70 105 v dc blocking voltage v dc 100 150 v average forward rectified current (t a =75 o c) i fav 10 10 a peak forward surge current, 50hz half sine-wave (t a =25 o c) i fsm 175 175 a repetitive peak forward c (f>15hz) i frm 5 5 a instantaneous forward voltage@5.0a v f 0.85 0.90 v leakage current (t j =25 o c, v r =v rrm ) 0.2 0.2 ma leakage current (t j =100 o c, v r =v rrm ) i r 20 20 ma typical thermal resistance r jc 2.4 3.5 2.4 3.5 c/w operating junction temperature range t j -65 to +150 c storage temperature range t stg -65 to +150 c
hi-sincerity microelectronics corp. spec. no. : he200802 issued date : 2008.08.19 revised date :2009.11.06 page no. : 2/4 hsbr10100ct series ~hsbr10150ct series hsmc product specification characteristics curve maximum non-repetitive peak forward surge current 0 20 40 60 80 100 120 140 160 180 200 1 10 100 number of cycles at 50hz peak forward surge current(a) ` t j=t jmax.8.3ms single half sine-wave(jedec method) maximum non-repetitive peak forward surge current 0 20 40 60 80 100 120 140 160 180 200 1 10 100 number of cycles at 50hz peak forward surge current(a) ` t j=t jmax.8.3ms single half sine-wave(jedec method) typical instantaneous forw ard characteristics 0.001 0.01 0.1 1 10 0 0.2 0.4 0.6 0.8 1 vf,forw ard voltage(v) if,forward curren t 150v 100v ta=25 typical reverse characteristics 0.0001 0.001 0.01 0.1 1 02040608010012 percent of rated peak reverse voltage(v) instantaneous reverse curre typical reverse characteristics 0.0001 0.001 0.01 0.1 1 0 50 100 150 percent of rated peak reverse voltage(v) instantaneous reve current(ma) tj=150 100v 0 n tj=25 t j =150 t j =125 t j =100 t j =7 5 150v tj=120 tj=100 tj=75 tj=25 forward current derating curve 0 2 4 6 8 10 12 0 25 50 75 100 125 150 175 lead temp erature( ) average forward curre n resistive or inductive load 0.375"(9.5mm)lead length
hi-sincerity microelectronics corp. spec. no. : he200802 issued date : 2008.08.19 revised date :2009.11.06 page no. : 3/4 hsbr10100ct series ~hsbr10150ct series hsmc product specification to-220ab dimension dim min. max. a 5.58 7.49 b 8.38 8.90 c 4.40 4.70 d 1.15 1.39 e 0.35 0.60 f 2.03 2.92 g 9.66 10.28 h - *16.25 i - *3.83 j 3.00 4.00 k 0.75 0.95 l 2.54 3.42 m 1.14 1.40 n - *2.54 o 12.70 14.27 p 14.48 15.87 *: typical, unit: mm 3-lead to-220ab plastic package hsmc package code: e a b e g i k m o p 3 2 1 c n h d tab f j l marking: note: green label is used for pb-free packing pin style: 1.anode 2.cathode 3.anode material: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammabilit y solid burnin g class: ul94v-0 dim min. max. a 5.58 7.49 b 8.38 8.90 c 4.40 4.70 d 1.15 1.39 e 0.35 0.60 f 2.03 2.92 g 9.66 10.28 h - *16.25 i - *3.83 j 3.00 4.00 k 0.75 0.95 l 2.54 3.42 m 1.14 1.40 n - *2.54 o 12.70 14.27 p 14.48 15.87 *: typical, unit: mm 3-lead to-220ab plastic package hsmc package code: e a b e g i k m o p 3 2 1 c n h d tab f j l marking: note: green label is used for pb-free packing pin style: 1.anode 2.cathode 3.anode material: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammabilit y solid burnin g class: ul94v-0
hi-sincerity microelectronics corp. spec. no. : he200802 issued date : 2008.08.19 revised date :2009.11.06 page no. : 4/4 hsbr10100ct series ~hsbr10150ct series hsmc product specification to-220fp dimension a b d f g h i k l m 3 2 1 c j n 3 e 1 2 o 4 5 marking: 3-lead to-220fp plastic package hsmc package code: f style: 1.anode 2.cathode 3.anode inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.2480 0.2520 6.30 6.40 k - *0.1004 - *2.55 b 0.3386 0.3425 8.60 8.70 l 0.5118 0.5906 13.00 15.00 c 0.1673 0.1870 4.25 4.75 m 0.5886 0.5925 14.95 15.05 d 0.1043 0.1083 2.65 2.75 n - *0.0669 - *1.70 e 0.0230 0.0242 0.58 0.61 o 0.1098 0.1114 2.79 2.83 f 0.3980 0.4039 10.11 10.26 1 - -2 - *2 g 0.1083 0.1122 2.75 2.85 2 - *5 - *5 h 0.3386 0.3425 8.60 8.70 3 - *15 - *15 i - *0.1496 - *3.80 4 - *5 - *5 j - *0.0236 - *0.60 5 - *5 - *5 notes: 1.dimension and tolerance based on our spec. dated sep. 07,1997. 2.controlling dimension: millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please c ontact your local hsmc sales office. material: ? lead: 42 alloy; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer prod uct design, infringement of paten ts, or application assistance. head office and factory: ? head office (hi-sincerity microelectronics corp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712
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